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UID:DSC-20162
DTSTART;TZID=Europe/Berlin:20230927T163000
SEQUENCE:1695793328
TRANSP:OPAQUE
DTEND;TZID=Europe/Berlin:20230927T173000
URL:https://dresden-science-calendar.org/calendar/de/detail/20162
LOCATION:TUD\,    
SUMMARY:Swaminathan: The Future of Heterogeneous Integration – Challenges
  &amp\; Opportunities
CLASS:PUBLIC
DESCRIPTION:Speaker: Prof. Madhavan Swaminathan\nInstitute of Speaker: The 
 Pennsylvania State University\, USA\nTopics:\n\n Location:\n  Name: TUD ()
 \n  Street:   \n  City:  \n  Phone: \n  Fax: \nDescription: &amp\;lt\;p&am
 p\;gt\;&amp\;lt\;strong&amp\;gt\;Abstract&amp\;lt\;/strong&amp\;gt\;&amp\;
 lt\;br&amp\;gt\;The global semiconductor industry is projected to become a
  trillion-dollar industry by 2030. This is historic considering that it to
 ok the industry 55 years to reach half a trillion dollars in size and will
  take just another 10 years to double in size to a trillion dollars. Advan
 ced packaging is expected to play an important role in making this happen.
 &amp\;lt\;br&amp\;gt\;So\, what are the key drivers\, where are the challe
 nges and what are the innovations necessary in advanced packaging over the
  next decade and beyond to be able to support heterogeneous integration? W
 hy is semiconductor packaging becoming so important? These questions will 
 be addressed in the context of emerging applications.&amp\;lt\;/p&amp\;gt\
 ;
DTSTAMP:20260412T224417Z
CREATED:20230920T053740Z
LAST-MODIFIED:20230927T054208Z
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