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UID:DSC-23092
DTSTART;TZID=Europe/Berlin:20261020T083000
SEQUENCE:1787231611
TRANSP:OPAQUE
DTEND;TZID=Europe/Berlin:20261020T183000
URL:https://dresden-science-calendar.org/calendar/en/detail/23092
LOCATION:Fraunhofer IKTS \, Winterbergstraße 2801277 Dresden
SUMMARY:Clausner: CapTech – Reliability of Electronic Systems by advanced
  Simulation Techniques and Innovation of Ceramic Technologies
CLASS:PUBLIC
DESCRIPTION:Speaker: Dr. André Clausner\, Dr. Mike Röllig\nInstitute of S
 peaker: Fraunhofer IKTS\nTopics:\nPhysik\, Informatik\, Materialien\n Loca
 tion:\n  Name: Fraunhofer IKTS  (Winterbergstr. 28\n01277 Dresden)\n  Stre
 et: Winterbergstraße 28\n  City: 01277 Dresden\n  Phone: +49 351 2553-770
 0\n  Fax: +49 351 2553-7600\nDescription: Fraunhofer IKTS and EDA invite i
 ndustrial partners\, stakeholders on defence and security technical soluti
 ons and interested system designers to an “Ceramic Technology and Electr
 onic System Reliability” workshop. The EDA supports the EU Member States
  in improving their military capabilities\, in particular through European
  cooperation within the framework of the Common Security and Defence Polic
 y. Electronics development serves to achieve military capabilities and sys
 tems. Within this framework\, electronics development is an integral part 
 of almost all prioritized capability areas\, in:    - Sensors and reconnai
 ssance  - Command\, control\, communications and information systems (C4IS
 R)  - Unmanned systems and autonomy  - Cyber and space capabilities  - Ele
 ctronic warfare and protection systems    CapTechs (Capability Technology 
 Areas) are the central technical and technological working instrument of t
 he EDA\, particularly for technology‑driven domains such as electronics 
 and systems development.    Within the upcoming #64 Workshop of the CapTec
 h series in Dresden at Fraunhofer IKTS following main topics and highlight
 s will be presented:    - Future ceramic technology and materials for hars
 h environments  - Advanced design for reliability from system to chip-leve
 l  - Advanced analytics with high resolution and by NDT-technologies  - Ad
 vanced connector/ interconnector technology    The networking event is foc
 used on experts exchange of Know-how\, companies demands and system develo
 pers along the value chain from chip-level to electronics system level. Th
 e laboratories and the technological diversity along the value chain from 
 ceramic materials to electronic for harsh environment will be open for nex
 t generation reliable and cost-effective solutions.
DTSTAMP:20260826T042844Z
CREATED:20260820T131331Z
LAST-MODIFIED:20260820T131331Z
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